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Ideal for PCB manufacturing with uniform thickness and high purity.
Offers superior flexibility and fatigue resistance, perfect for flexible circuits.
Designed for heat-sensitive environments and thermal applications.
Used for EMI/RFI shielding in cables and electronic devices.
Enables efficient signal transmission in electronic circuits.
Easy to bend, wrap, or laminate for various configurations.
Clean, smooth surfaces suited for adhesive bonding and lamination.
Reliable in demanding environments and prolonged use.
Supports sustainable design and responsible manufacturing.
Base layer in single and multi-layer circuit boards.
Reduces electromagnetic interference in cables and devices.
Used in wearable tech, sensors, and flexible displays.
Conductive layers in lithium-ion and EV battery assemblies.
Thin layers used for compact, high-performance windings.
Copper foils are typically available in thicknesses ranging from 5 microns (µm) to 200 microns (µm). We also offer custom thicknesses to suit specific technical or industrial needs.
Copper foil is widely used in PCB manufacturing, EMI/RFI shielding, battery packs, flexible electronics, and even artistic and craft applications due to its flexibility and conductivity.
Rolled copper foil offers better flexibility and fatigue resistance, ideal for flexible circuits. Electrolytic copper foil is cost-effective and suitable for rigid PCBs with uniform thickness and high purity.
Yes, copper foil is solderable and easy to laminate. It adheres well to a variety of substrates using adhesives, and can be soldered in electronic assemblies with the proper surface preparation.
Copper foil has natural corrosion resistance, but it may oxidize over time. Protective coatings or lamination can be applied if a bright, untarnished surface is required for your application.
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